| CPU |
Quad-core 64-bit Cortex-A55, maximum frequency up to 2.0GHz |
| GPU |
ARM G52 2EE, supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1 |
| NPU |
Maximum computing power up to 1TOPS |
| Memory |
2G/4G/8G (optional) |
| Built-in Storage |
EMMC 16G/32G/64G/128G/256G (optional) |
| Operating System |
Android 11 |
| Playback Modes |
Supports loop, scheduled, insert and other playback modes |
| Supported Image Formats |
BMP, JPEG, PNG, GIF |
| Power Supply Interface |
1 built-in 2.54MM 6P power input interface and 1 DC jack interface (outer diameter 5.5mm, inner core 2.0mm) |
| LVDS Output |
2 single/double-channel 30PIN DuPont interfaces, directly driving LCD screens of various resolutions at 50/60Hz |
| MIPI Output |
2 4-LIN MIPI screens (40P 0.5MM pitch FPC interface), directly driving 2 MIPI LCD screens |
| EDP Output |
1 2-LIN EDP screen (30P 0.5MM pitch FPC interface), maximum support for 1920*1080 output |
| HDMI Output |
1 Type-A interface, supports 1080P, 2K, 4K output |
| TF Card |
Supports 16G/32G/64G/128G (theoretically supports larger capacities as long as they comply with SD3.0 and MMC ver4.51 protocols) |
| CTP Interface |
2 I2C touch screen interfaces, capable of driving two I2C touch screens simultaneously |
| Remote Control & Indicator Light |
Supports infrared remote control button operation and device working status indicator |
| Serial Port/Expansion Interface |
6 TTL, 8 GPIO |
| Audio & Video Output |
1 4-wire headphone jack (US standard), 1 dual-channel speaker output interface (supports 8Ω/5W power amplifier for left and right channel output) |
| Audio Input |
1 microphone interface (2PIN pin) |
| Gravity Sensing |
Supported, not pasted by default |
| RTC Real-Time Clock |
Supported, with scheduled power on/off function |
| USB Interface |
2 USB3.0, 5 built-in USB sockets |
| System Upgrade |
Supports local USB upgrade, wireless upgrade, and computer-based upgrade |
| Network Support |
1. Supports 10/100M/1000M adaptive Ethernet 2. Built-in WiFi and Bluetooth; WiFi supports hotspot sharing 3. Expandable 4G Internet access (requires additional USB 4G module) |
| Dimension |
127.5mm * 84.50mm / ±0.5mm, board thickness 1.6mm ±10% |
| Operating Environment |
Temperature: 0°C - 80°C (recommended 5°C ~ 35°C), Humidity: 10% ~ 90% (non-condensing) |
| Industrial-Grade Chip |
RK3568J operating temperature: -40°C - 85°C |